Mounting and replacement of components with high density integration

ELEstahováníOur company is also specialized in the mounting and replacing of components with high integration, such a BGA (Ball Grid Array), PGA (Pin Grid Array), QFP (Quad Flat Package) and other. For this purposes we have high-end rework station ERSA IR/PL 650A.




ELE_bgeThe BGA technology is characterized by the bottom side of the circuit which is covered with a large number of contacts shaped in rectangular grid, which may not be completely regular and some parts may be omitted. The balls of tins are applied on the each contact, which create wire between PCB and BGA housing after soldering. Therefore it´s obvious, that the mounting or replacement can´t be done without adequate technical equipment.